High resolutions in high-end multimedia products result in high thermal loads in electronic assemblies. When it comes to the hand or finger contact required for operation, the temperatures on accessible surfaces must not exceed regulated maximum values.
Targets & Workflow
Determination of the volumetric temperature distribution on the components and on relevant surfaces. All heat transport mechanisms (conduction, convection, radiation) had to be taken into account, including the illustration of the installed circuit board and the microelectronic components. CAD data provided by the customer served as the basis for the simulation. After preparation according to requirements, a multi-physical (thermal-electrical) flow analysis was carried out.
Results & Customer Benefits
The analyses provided a comprehensive insight into the product's thermal system behaviour. As a result, we have put forward concrete and effective measures for improvement. For the customer, this resulted in significant efficiency advantages due to the simulation and visualisation of the temperature distribution and, as a result, the saving of prototype loops.